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Chaque projet soutenu par Gebert Rüf Stiftung est présenté sur le site web de la fondation avec en particulier les données de base du projet. Par cette publication, la fondation informe sur les résultats du soutien accordé et contribue à la communication scientifique au sein de la société.

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Corintis – Cooler chips to enable the future of computing

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Données de projet

  • Numéro du projet: GRS-010/22 
  • Subside accordé: CHF 150'000 
  • Consentement: 05.05.2022 
  • Durée: 03.2023 - 09.2024 
  • Champs d'activité:  InnoBooster, seit 2018

Direction du projet

Description du projet

In today's digital age, the demand for more powerful computing, ranging from cloud services to drug discovery, is incessant. As we push the boundaries of microelectronic chip performance, we face an escalating challenge: increasing power densities and the consequential risk of chip overheating. This not only hampers the performance but also contributes to a significant energy drain, with data centers alone consuming more electricity than major cities like New York and London combined.

Addressing this pressing issue, Corintis has embarked on a project to revolutionize chip cooling. Instead of relying on traditional methods where heat must traverse multiple layers before extraction, we've innovatively approached the problem at its core. We've pioneered a precision microfluidic cooling solution, embedding a network of microscopic channels directly into the chips. Through this, cooling liquid can efficiently extract heat, achieving a staggering 10 times more efficiency than prevailing market solutions and boosting energy efficiency by over 50 times.

Our project is not just about innovation; it's about ensuring reliability. We're meticulously developing robust testing and modeling capabilities for our microchannel cooling solutions, aiming to transition our partnerships with semiconductor giants from mere R&D collaborations to full-fledged commercial ventures. By offering a tailored, full-stack solution for chip designers, Corintis is setting the stage for a new era of sustainable and efficient computing.

Etat/résultats intermédiaires

Corintis's project focuses on the long-term reliability of microchannel cooling for microelectronics. Through comprehensive thermal testing, practical application of Thermal Test Vehicles (TTVs), and detailed numerical modelling, we've established key parameters for our cooling solutions. Our findings guide material and design decisions, ensuring efficient chip cooling. This research serves as a foundational step, helping Corintis transition from pilot prototypes to designs suitable for industrial application, meeting the specific demands of the evolving microelectronics sector in Switzerland.

Liens

Personnes participant au projet

Iordan Doytchinov, Program Manager at Corintis
Samuel Harrison, Project Leader at EPFL, Co-Founder
M. Ali Slim, Responsible technical lead, Reliability engineer at Corintis

Dernière mise à jour de cette présentation du projet  10.04.2024