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Corintis – Cooler chips to enable the future of computing

Redaktion

The project management is responsible for the content of the information provided.

Projektdaten

  • Projekt-Nr: GRS-010/22 
  • Förderbeitrag: CHF 150'000 
  • Bewilligung: 05.05.2022 
  • Dauer: 03.2023 - 09.2024 
  • Handlungsfeld:  InnoBooster, seit 2018

Projektleitung

Projektbeschreibung

In today's digital age, the demand for more powerful computing, ranging from cloud services to drug discovery, is incessant. As we push the boundaries of microelectronic chip performance, we face an escalating challenge: increasing power densities and the consequential risk of chip overheating. This not only hampers the performance but also contributes to a significant energy drain, with data centers alone consuming more electricity than major cities like New York and London combined.

Addressing this pressing issue, Corintis has embarked on a project to revolutionize chip cooling. Instead of relying on traditional methods where heat must traverse multiple layers before extraction, we've innovatively approached the problem at its core. We've pioneered a precision microfluidic cooling solution, embedding a network of microscopic channels directly into the chips. Through this, cooling liquid can efficiently extract heat, achieving a staggering 10 times more efficiency than prevailing market solutions and boosting energy efficiency by over 50 times.

Our project is not just about innovation; it's about ensuring reliability. We're meticulously developing robust testing and modeling capabilities for our microchannel cooling solutions, aiming to transition our partnerships with semiconductor giants from mere R&D collaborations to full-fledged commercial ventures. By offering a tailored, full-stack solution for chip designers, Corintis is setting the stage for a new era of sustainable and efficient computing.

Stand/Resultate

Corintis's project focuses on the long-term reliability of microchannel cooling for microelectronics. Through comprehensive thermal testing, practical application of Thermal Test Vehicles (TTVs), and detailed numerical modelling, we've established key parameters for our cooling solutions. Our findings guide material and design decisions, ensuring efficient chip cooling. This research serves as a foundational step, helping Corintis transition from pilot prototypes to designs suitable for industrial application, meeting the specific demands of the evolving microelectronics sector in Switzerland.

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Am Projekt beteiligte Personen

Iordan Doytchinov, Program Manager at Corintis
Samuel Harrison, Project Leader at EPFL, Co-Founder
M. Ali Slim, Responsible technical lead, Reliability engineer at Corintis

Letzte Aktualisierung dieser Projektdarstellung  20.06.2024